Wafers/Silicon Wafers: Cleaning of 8-12 inch patterned/unpatterned wafers, including particle/organic removal, and post-photoresist stripping cleaning.

Grinding plate/light grinding: Non-destructive cleaning under the protective film, cleaning alignment marks, reducing rework rate and film damage.

Advanced Packaging: Supports 3D stacking/fan-out processes, covering wafer/panel-level packaging front and back as well as high aspect ratio structure cleaning.

MEMS/micro/nano devices: Post-release cleaning + high aspect ratio structure for particle removal, avoiding cavitation damage and improving product yield.

Process-grade cleaning: Covering the entire process including pre-cleaning, resist removal cleaning, silicon nitride removal, metal (Co, Ti) removal, RCA cleaning, etc.

Specialized cleaning: Recycle cleaning, post-polishing cleaning, pre/post-Epi cleaning, pre/post-diffusion cleaning, pre-epitaxial cleaning

Component cleaning: Immersion cleaning of quartz tubes/boats, quartz plates, ignition cannons, etc.; spray cleaning of quartz tubes.

Nanoscale cleaning precision enables thorough removal of micro- and nano-sized impurities such as particles, organic matter, and residues.

Non-destructive process assurance: Employing megasonic technology avoids cavitation damage and film destruction, thereby improving product yield and reliability.

Full-scenario adaptability, covering core scenarios and advanced processes throughout the entire process, eliminating the need for switching between multiple suppliers and reducing manufacturing costs.