The multi-wafer megasonic cleaning system uses high-frequency shear forces in liquid, combined with cleaning chemistry, to efficiently remove nanoscale particles without damaging wafer surfaces. Its short wavelength enables deep cleaning of high aspect ratio micropores, meeting precision cleaning needs in semiconductors, optics, and high-end medical fields. As a key SCI multi-wafer cleaning step, it offers multiple control modes, supports local/remote communication, and provides linearly adjustable 1200W power to match different process requirements.