Empowering capacity expansion and cost optimization with megasonic technology

The core of megasonic technology is the use of high-frequency sound waves above 1MHz to achieve precision cleaning, material processing, and other functions; it is a high-frequency extension of ultrasonic technology.

Core principle: High-frequency sound waves propagate in a medium (mostly liquid), generating tiny cavitation bubbles. These cavitation bubbles collapse instantaneously, releasing extremely strong impact force, accompanied by localized high temperature and pressure. The high-frequency characteristics allow for smaller, denser cavitation bubbles, resulting in more precise and gentler effects.

1. High-Frequency Precision: Utilizes advanced high-frequency acoustic technology, achieving nanometer-level cleaning precision.

2. Intelligent Control: Equipped with an intelligent control system for precise control and monitoring of process parameters.

3. Modular Design: Flexible modular design allows for customized configurations to meet customer needs.

4. Stable and Reliable: Employs high-quality materials and precision manufacturing processes to ensure long-term stable operation.

5. Energy Saving and Environmental Protection: An optimized energy management system reduces operating costs.

6. Comprehensive Service: Provides comprehensive technical support and after-sales service.

Wafer Cleaning: Removes particles, organic matter, and metal contaminants from the wafer surface.

Post-Photolithography Cleaning: Removes photoresist residue and particulate contaminants.

Post-Chemical Mechanical Polishing (CMP) Cleaning: Removes slurry residue after CMP.

Packaging Cleaning: Precision cleaning during chip packaging.

Equipment Component Cleaning: Maintenance cleaning of critical components in production equipment.

Megasonic cleaning technology effectively improves product yield and reduces defect rates, making it an indispensable key process in semiconductor manufacturing.

1. High Cleaning Efficiency: High-frequency cavitation rapidly removes fine particles and contaminants.

2. Low Damage: The gentle cleaning process does not damage delicate structures or sensitive materials.

3. Environmentally Friendly and Energy-Saving: Reduces the use of chemical agents, lowering energy consumption and environmental impact.

4. Good Consistency: Stable cleaning results with minimal batch-to-batch variation.

5. Strong Adaptability: Capable of handling complex shapes and intricate structures.

6. Cost Savings: Improves yield, reduces defective products, and lowers overall production costs.

1. High-Frequency Precision: Utilizes advanced high-frequency acoustic technology, achieving nanometer-level cleaning precision.

2. Intelligent Control: Equipped with an intelligent control system for precise control and monitoring of process parameters.

3. Modular Design: Flexible modular design allows for customized configurations to meet customer needs.

4. Stable and Reliable: Employs high-quality materials and precision manufacturing processes to ensure long-term stable operation.

5. Energy Saving and Environmental Protection: An optimized energy management system reduces operating costs.

6. Comprehensive Service: Provides comprehensive technical support and after-sales service.

The core differences between ultrasound and megasonic waves lie in their frequencies, cleaning principles, and applicable scenarios.

① Different frequency ranges: Ultrasonic frequencies are typically between 20kHz and 1MHz, while megasonic frequencies range from 1MHz to over 10MHz, with the latter being significantly higher.

② Different cleaning principles: Ultrasonic waves rely on the impact force generated by cavitation to clean, while megasonic waves act directly on contaminants with high-frequency vibrations, resulting in a weaker cavitation effect.

③ Different applicable scenarios: Ultrasonic waves are suitable for removing larger particulate contaminants and are used for general precision component cleaning; megasonic waves offer higher cleaning precision and are suitable for applications with extremely high cleaning requirements, such as semiconductors and optics.

Semiconductor Industry: Used for removing minute particles during wafer manufacturing, ensuring precise chip circuit fabrication. Cleans residual contaminants during chip packaging, improving device reliability.

Optics Industry: Cleans oil, dust, and fingerprints from the surfaces of optical lenses, prisms, and other components, ensuring stable optical performance. Processes optical thin film products, removing impurities during thin film preparation and improving film quality.

Medical Industry: Cleans precision surgical instruments, thoroughly removing bloodstains, tissue residue, etc., to meet aseptic requirements. Processes medical glassware and miniature medical devices, ensuring the cleanliness of medical supplies.

Precision Manufacturing Industry: Cleans miniature mechanical parts and precision molds, removing chips and oil from the processing. Cleans electronic components such as sensors and connectors, ensuring their stable performance.

Megasonic waves cannot completely replace ultrasonic waves. Due to differences in their technical characteristics, they are complementary rather than substitutive.

The core reasons for their non-substitutability are:

① Different applicable cleaning needs: Ultrasonic waves are suitable for removing larger particles (tens of micrometers in size) of contaminants, with lower cleaning costs, and are suitable for general precision parts cleaning; megasonic waves focus on removing nanoscale particles, with higher costs, and are only suitable for high-precision scenarios.

② Different effects on the objects being cleaned: Ultrasonic waves have a stronger cavitation effect, making them more efficient at cleaning some rough precision parts; megasonic waves vibrate gently, with a low risk of damage, but are insufficient for cleaning stubborn large particles.

③ Differences in cost and cost-effectiveness: The equipment and maintenance costs of megasonic waves are much higher than those of ultrasonic waves. For ordinary cleaning needs, ultrasonic waves have a more cost-effectiveness advantage.

Both have clearly defined roles based on requirements such as cleaning precision, contaminant type, and cost budget. Ultrasonic waves are suitable for routine precision cleaning, while megasonic waves focus on high-requirement scenarios, both covering different levels of cleaning needs.