Highlights of the closing day of SEMI-e Shenzhen International Semiconductor Exhibition! Harcody's megasonic technology ignites a new revolution in the industry.

I. Technological Breakthrough: Megasonic Cleaning Reconstructs Industry Standards

At booth 16E72 in Hall 16 of HaKeDi's exhibition,HaKeDi's 1MHz series of mega-sonic cleaning equipment attracted considerable attention. Among them, the 1MHz 250W nozzle-type spray head achieves efficient removal of nanoscale contaminants from wafer surfaces through precise sound field control, making it particularly suitable for the high-precision cleaning needs of advanced packaging processes. Meanwhile, the 1MHz 1200W quartz transducer monolithic water bath equipment, leveraging the chemical inertness and high stability of quartz material, provides a "zero-damage" cleaning solution for third-generation semiconductor materials such as silicon carbide wafers, perfectly meeting the current mass production needs of wide-bandgap semiconductors.

It is worth mentioning that HaKeDi's independently developed multi-frequency ultrasonic cleaning system covers the entire frequency band from 40kHz to 270kHz. It can intelligently switch frequency combinations according to different process requirements, achieving a dual breakthrough in cleaning efficiency and cleanliness in scenarios such as grinding plate cleaning and MEMS device processing. This "customized cleaning" mode is an innovative practice to address the diversified trend of semiconductor manufacturing processes.

II. Implementation Scenarios: Industry-Academia-Research Collaboration Accelerates Technology Transfer

As a benchmark project for technology transfer from Harbin Institute of Technology (Shenzhen), Hacodi revealed at booth 16E72 in Hall 16 that its mega-sonic cleaning solution has been verified on a 12-inch wafer fab in China, with a cleaning yield that is 30% higher than that of traditional ultrasonic cleaning technology.

"HaKeDi has solved the industry challenge of controlling cavitation effects in mega-sonic cleaning through the deep integration of acoustic simulation and process optimization," said a Hacody technician during a live demonstration. He explained that their proprietary acoustic field control algorithm can control the diameter of cavitation bubbles to below 10 micrometers, fundamentally preventing damage to the wafer surface.

III. Industry Resonance: High-end Manufacturing Enterprises Flock In

On the final day of the exhibition, HaKeDi's booth 16E72 in Hall 16 remained popular, attracting semiconductor company teams for discussions. Several semiconductor companies expressed their intention to collaborate, hoping to introduce megasonic cleaning technology into their production lines to meet the stringent cleaning precision requirements of new processes such as 3D integration and Chiplet. A representative from a leading equipment manufacturer stated, "HaKeDi's technology roadmap is highly aligned with the current trend of domestic semiconductor equipment development, and its products are already internationally competitive in terms of cost-effectiveness and reliability."

Furthermore, the on-site technical collaboration between HaKeDi and semiconductor wet cleaning equipment manufacturers laid the foundation for building a complete "cleaning-etching-thin film" solution. This collaborative innovation model across the industry chain vividly illustrates how SEMI-e Shenzhen International Semiconductor Exhibition promotes industry development.

IV. Future Outlook: From Technological Breakthroughs to Ecosystem Building

As semiconductor manufacturing evolves towards smaller processes and higher integration, the importance of the cleaning process is becoming increasingly prominent. HaKeDi is building a complete ecosystem for megasonic cleaning through a closed-loop industry-academia-research model that combines university R&D, enterprise commercialization, and scenario verification. As one expert at the exhibition forum stated, "Megasonic cleaning technology is expected to become the mainstream solution for back-end cleaning in semiconductor manufacturing, and HaKeDi's innovative practices provide a replicable development paradigm for the industry."

Although the SEMI-e Shenzhen International Semiconductor Exhibition 2025 has concluded, HaKeDi's exploration of megasonic cleaning technology continues. It is understood that its next-generation megasonic high-frequency high-power cleaning system will integrate an AI process optimization module, further enhancing the intelligence level of the cleaning process. This acoustically driven semiconductor manufacturing revolution is continuously taking shape in Shenzhen, a hotbed of innovation.