Home  >   News  >   Company News  >   From Expo Booth to Semiconductor Fabs: HaKeDi Megasonic, a "Bao'an Smart Manufacturing" Calling Card

From Expo Booth to Semiconductor Fabs: HaKeDi Megasonic, a "Bao'an Smart Manufacturing" Calling Card

Time: 2026-08-28

Views: 32189

Source: HaKeDi Megasound

On August 28, 2026, the five-day "Bao'an Premium Products Exhibition & Sales Campaign" concluded at the Bao'an District Government Building. As a Bao'an-based megasonic technology company, HaKeDi Megasound Technology (Shenzhen) Co., Ltd. ("HaKeDi") showcased its bonded-type megasonic module HKD-MegPie-V-1M250W, demonstrating Bao'an's precision-cleaning strength in semiconductor manufacturing to the district's deputies and committee members.AP0A0019-opq4963448851.jpg

1. Bringing the Industrial Landscape into the "Two Sessions": 103 Companies, 300+ Premium Products

Hosted by the Bao'an District Enterprise Service Center, the "Bao'an Premium Products Exhibition & Sales Campaign" ran from August 24 to 28, 2026, on the second floor of the Bao'an District Government Building, under the theme "Building a Modern Industrial System to Forge High-Quality Development Support." During the event, more than 300 products from 103 companies were showcased, 23 new products made their debut, and 32 companies offered special discounts of 20–40% on 180+ products. Following the "Products – Capabilities – Ecosystem" logic, the venue was organized into six functional exhibition zones covering more than 10 industry sectors, including semiconductors & integrated circuits, high-end equipment & instruments, and smart terminals [1][2].

For Bao'an, this was more than a product display. Bringing the industrial landscape into the "Two Sessions" is a tangible expression of the district's shift from "scale advantages" to "ecosystem competitiveness," and a practical validation of enterprise services evolving from "responsive service" to "proactive support" [2].AP0A0027-opq4963488407.jpg

2. HaKeDi: A Bao'an "Hard-Tech" Company Deep in Megasonics

Headquartered in Bao'an, Shenzhen, HaKeDi Megasound Technology (Shenzhen) Co., Ltd. focuses on R&D and manufacturing of megasonic and multi-frequency ultrasonic key modules and generators for semiconductor and other high-precision manufacturing, as well as repair services for megasonic cleaning systems [4]. In 2022, the company undertook a Shenzhen Innovation & Entrepreneurship Program key technology breakthrough project targeting megasonic cleaning key technologies and equipment — one of the representative precision-cleaning equipment suppliers in China's "domestic substitution" drive [4].

In semiconductor manufacturing, cleaning directly affects yield and device reliability. Megasonic equipment has long relied on imports. HaKeDi targets exactly this link, combining high-frequency acoustic technology with engineering capability to deliver integratable megasonic modules for domestic fabs.ZERO7114-opq4967777501.jpg

3. Booth Highlight: Bonded-Type Megasonic Module HKD-MegPie-V-1M250W

The HKD-MegPie-V-1M250W bonded-type megasonic module HaKeDi brought to the expo adopts a bonded structure with transducers close to the workpiece, providing relatively uniform acoustic-field coverage for wet precision-cleaning applications. Key specifications:

Parameter

Value

Model

HKD-MegPie-V-1M250W

Module type

Bonded (pie) megasonic

Operating frequency

1 MHz

Max power

250 W

Power adjustment

5–250 W

Supply voltage

220 VAC ±10%

Frequency tracking / verification / constant power

Supported

Online monitoring

Supported

Communication

RS485, Ethernet, I/O control

Transducer carrier materials

PEEK / sapphire single crystal

Operating environment

0–40°C, 0–90% RH

Supported liquid temperature (standard version)

<80°C

The bonded form suits process steps such as post-CMP cleaning, pre-polish cleaning, film coating, resist stripping, development, lens cleaning, and microelectronics precision cleaning. Common features — PLL real-time frequency tracking, constant power output, and swept-frequency driving — keep output stable under load and liquid-temperature variations; with RS485 / Ethernet / I/O interfaces, the module integrates easily into wet-process tools [4].

4. Why Semiconductor Fabs Value Megasonic Cleaning

Megasonic cleaning drives liquid with high-frequency mechanical waves at roughly the 1 MHz level, removing surface particles through stable cavitation and micro-streaming while keeping damage to delicate structures low [3]. Academic studies show that in ammonia hydroxide solutions, megasonic cleaning causes significantly less feature damage than ultrasonic cleaning on nanoscale patterns, while efficiently removing sidewall particles after silicon etch [3]; in post-etch polymer removal for the 0.13-μm Cu/low-k dual damascene process, megasonic enhancement substantially reduced process time without damage [5].

Simply put: the finer the particles and the more fragile the structures, the more a "high-frequency, low-damage" method like megasonics is needed — which is why chip-final cleaning and advanced packaging raise the frequency to the 1 MHz level.

Tech Tip: What does 1 MHz mean? Conventional industrial ultrasonic cleaning typically runs at 40–120 kHz; megasonic sits around 1 MHz (1000 kHz) — more than an order of magnitude higher, producing smaller, gentler cavitation bubbles, better suited to nano-scale particle removal and low-damage cleaning [3].274be422c97c8aee8d4f82b702504367.jpg

5. From "Made in Bao'an" to "Smart-Made in Bao'an"

During the campaign, the "Bao'an Premium Products" digital cloud platform was officially launched, taking Bao'an's premium products from five days of offline sales to year-round online exposure [1][2]. For HaKeDi, the expo's conclusion is not an end: domestic megasonic modules represented by the HKD-MegPie-V-1M250W will continue to move from Bao'an into more semiconductor fabs, keeping "Bao'an Smart Manufacturing" visible and verified in the critical link of precision cleaning.AP0A9736-opq4963274052.jpg

FAQ

1. What is the difference between megasonic and ultrasonic cleaning in semiconductors?

Megasonic cleaning (around 1 MHz) removes finer particles — from sub-micron down to nano-scale — with lower damage risk to delicate structures; ultrasonic cleaning relies mainly on mid/low-frequency cavitation, handles mid-to-small particle sizes, and carries a relatively higher damage risk. For damage-sensitive steps such as chip-final cleaning, megasonics is usually the preferred choice [3].

2. What applications suit the bonded-type megasonic module?

It suits wet precision-cleaning applications where the transducer is close to the workpiece and relatively uniform acoustic-field coverage is desired — e.g., post-CMP cleaning, pre-polish cleaning, film coating, resist stripping, development, lens and microelectronics precision cleaning. The HKD-MegPie-V-1M250W operates at 1 MHz with a max power of 250 W (adjustable 5–250 W) [4].

3. Where is HaKeDi located?

HaKeDi Megasound Technology (Shenzhen) Co., Ltd. is based in Bao'an, Shenzhen, specializing in R&D and manufacturing of megasonic/multi-frequency ultrasonic key modules and generators, plus repair services for megasonic cleaning systems. Official website: www.hkdsonic.com [4].

References

[1] Bao'an District People's Government Portal: Bao'an Premium Products Expo Brings the Industrial Landscape into the District "Two Sessions"

[2] Hong Kong Commercial Daily: A Concentrated Premium-Product Display So Manufacturing Strength Is Seen and Remembered

[3] Chu C-L, Lu T-Y, Fuh Y-K. The suitability of ultrasonic and megasonic cleaning of nanoscale patterns in ammonia hydroxide solutions for particle removal and feature damage. Semicond. Sci. Technol. 35 (2020) 045001

[4] HaKeDi Official Website - Products & Technology

[5] Enhancing the efficiency of postetch polymer removal using megasonic wet clean for 0.13-μm dual damascene interconnect process. Thin Solid Films


Disclaimer: The technical parameters and industry data in this article are sourced from public materials and the references listed above, and are provided for technical exchange and selection reference only. For specific equipment parameters, please refer to the manufacturer's latest official documentation. Corrections are welcome should any data errors or updates arise.


Table of Contents