Invitation | HaKeDi (HKD) Megasonic at CSEAC 2026, Booth A6-770

1. Opening: See You at Booth A6-770

HaKeDi Megasonic Technology (ShenZhen) Co., Ltd. will showcase the full 1MHz megasonic module lineup at CSEAC 2026. Booth A6-770, from August 31 to September 2, 2026, at the Wuxi Taihu International Expo Center. We sincerely invite R&D and procurement teams from semiconductor equipment makers, wafer fabs, and advanced packaging houses to discuss the localization path of 1MHz megasonic cleaning in semiconductor wet processes.

Figure 1 — HaKeDi (HKD) CSEAC 2026 Invitation (Booth A6-770)

2. About CSEAC 2026: A Bellwether for China's Semiconductor Equipment & Materials

CSEAC (Semiconductor Equipment, Materials and Core Parts Exhibition) is hosted by the China Electronic Special Equipment Industry Association. The 2026 edition is the 14th in the series. This year's exhibition area exceeds 70,000 m², gathering more than 1,300 exhibitors from China and abroad, and is expected to attract over 120,000 professional visitors. More than 20 concurrent forums are scheduled, and the floor area is 16.7% larger than the previous edition [1].

Overseas exhibitors account for 16% of the total, with nearly 30 Russian companies participating in a single country pavilion, underscoring the international reach of the show. The 20+ concurrent forums cover etching, thin-film deposition, advanced-process cleaning technology & equipment, metrology, bonding, and AI-driven electronic manufacturing equipment. The main forum will also release major industry updates [2][3].

For HaKeDi, the Advanced-Process Cleaning Technology & Equipment seminar is a particularly relevant venue — CSEAC 2026 lists "cleaning" as one of six dedicated technical seminars, which aligns directly with our focus on megasonic wet cleaning.

3. HaKeDi Booth Highlights: The Full 1MHz Megasonic Module Lineup

HaKeDi is the first high-tech company in China focused on the in-house R&D of megasonic modules for semiconductor wet-process equipment. Our portfolio covers four megasonic module families, multi-frequency ultrasonic generators, and a dedicated repair service [4].

3.1 Four Megasonic Module Families (by Process Step)

3.2 Repair Service

Covers transducer aging/damage, transducer-to-cavity bonding failure, generator circuit faults, frequency drift / runaway, and generator communication errors — extending the service life of existing megasonic production lines [4].

4. Why the Semiconductor Industry Needs Megasonic Cleaning

Megasonics use mechanical waves at frequencies above 1 MHz to drive the cleaning liquid. Combined with nano-scale cavitation bubbles, high energy density, and gentle impact force, megasonics can effectively remove sub-micron to nano particles without damaging wafers, chips, or optical components [4][5].

In our cleaning-technology comparison, megasonics' qualitative advantages are threefold: high micro-particle removal efficiency, low damage to chip surfaces, and low contamination. These traits are increasingly critical as advanced nodes (5nm and below) drive wafer surface contaminant sizes down to roughly 5 nm, where traditional cleaning methods gradually lose effectiveness [4].

On the localization front, China's semiconductor cleaning equipment market is projected to exceed RMB 8 billion in 2026, with the localization rate expected to rise above 35%. Megasonics, as a key technology in wet cleaning, is moving from "point substitution" to "full process step coverage".

5. What to Discuss On-Site & How to Register

5.1 Selection if-then (Map Your Scenario to a Module)

● Process is CMP, pre-polish, coating, stripping, developing or lens — batch/immersion → talk to us about TANK-type first.

● Process is in-line / localized jet, sensitive to flow rate & power window → talk to us about NOZZLE-type first.

● Need a large area of uniform action with the transducer close to the wafer → talk to us about BONDED (Pie) type first.

● Substrate is LCD / MiniLED panel, sapphire or optical component, in a shower scenario → talk to us about SHOWER (water-curtain) type first.

● Existing line shows frequency drift / transducer aging / communication errors → talk to us about REPAIR & UPGRADE first.

5.2 Registration

Scan the QR code on the invitation (Figure 1) to register instantly. Pre-registered visitors enjoy fast-track entry and on-site lucky draw. We suggest preparing three pieces of information in advance — process step, wafer size, and cleaning liquid type — so our engineers can quickly recommend a module and power window on the spot.

6. About HaKeDi (HKD)

HaKeDi Megasonic Technology (ShenZhen) Co., Ltd. (abbreviated as "HaKeDi" or "HKD") is dedicated to R&D of megasonic and multi-frequency ultrasonic modules and generators for high-end precision manufacturing, with business spanning semiconductors, optical components, medical devices, and precision MEMS devices. The company is certified to ISO 9001:2015 / GB/T 19001-2016 quality management system [4].

Contact

● Tel: 0755-81769988 ext. 2001

● Email: sale@hkdsonic.com

● Website: https://www.hkdsonic.com

● Address: 3F, Building B9, Plot A-5, Tongfuyu Industrial Park, Buyong Community, Shajing Street, Bao'an District, Shenzhen, China

FAQ

Q1: What is HaKeDi's booth number at CSEAC 2026, and where is it located?

A1: Booth A6-770 at the Wuxi Taihu International Expo Center. Show dates: August 31 – September 2, 2026 [1].

Q2: What does HaKeDi mainly showcase at this event?

A2: Four megasonic module families (tank / nozzle / bonded / shower), multi-frequency ultrasonic generators & plates, and a megasonic-system repair service — covering CMP, pre-polish, coating, stripping, developing, wafer, panel and optical component scenarios [4].

Q3: How does megasonic differ from ultrasonic in semiconductor cleaning, and when is megasonic a must?

A3: Megasonic typically refers to mechanical waves above 1 MHz. Compared with traditional ultrasonic (kHz range), the cavitation bubbles are smaller, the energy density is higher, and the impact is more gentle. It is well suited for sub-micron to nano particle removal and terminal chip cleaning, especially for advanced-node wafers and damage-sensitive devices [4][5].

Q4: What key parameters should semiconductor buyers check when selecting a megasonic module?

A4: Four dimensions: ① Frequency (≥1 MHz for terminal cleaning); ② Power (matched to process step and wafer size, e.g. tank-type 600/1200/2400 W for 6/8/12 inch respectively); ③ Communication interfaces (RS485 / MODBUS RTU / Ethernet / I/O); ④ Generator stability (PLL frequency tracking, constant power, sweep, full-domain protection) [4].

Q5: How do I pre-register to visit the HaKeDi booth?

A5: Scan the QR code on the invitation (Figure 1) to register online. Pre-registered visitors get fast-track entry and access to the on-site lucky draw. You may also email sale@hkdsonic.com in advance with your process needs and intended visit time [4].