Breaking through foreign technological monopolies and empowering China's advanced chip manufacturing processes.

HKD redefines semiconductor wet cleaning with megasonic technology.

Nanoscale zero-damage | High reliability | Fully customized cleanroom solutions

Core Products

Precisely targeting the cleaning pain points in different scenarios, providing you with targeted solutions to your precision cleaning challenges.

Discover More

Custom Solutions

Trough-type Megasonic Wave

800W single-tank or multi-tank design allows for flexible stacking, increasing cleaning efficiency by 30%.

Megasonic Nozzle

1-5MHz megasonic high-frequency vibration, 60W precise power control

MegaPie

0.2 submicron particle removal rate, uniform coverage without dead corners

Trough-type Megasonic Wave

800W single-tank or multi-tank design allows for flexible stacking, increasing cleaning efficiency by 30%.

Megasonic Nozzle

1-5MHz megasonic high-frequency vibration, 60W precise power control

MegaPie

0.2 submicron particle removal rate, uniform coverage without dead corners

Brand competitiveness

Breaking through technological barriers, we have successfully developed internationally competitive megasonic cleaning equipment and process systems.

The first domestic enterprise specializing in research

HKD, as China's first high-tech enterprise focusing on the independent research and development of megasonic modules for semiconductor wet cleaning equipment, has successfully developed a series of megasonic nanoscale cleaning products, helping China's semiconductor industry chain achieve independent control over key technologies.

Multi-scenario customized services

As an innovator in the field of megasonic nanoscale cleaning, Hacody leverages its fully independent intellectual property system and flexible customization capabilities to launch different products and services for industries such as semiconductors, optics, and medical, precisely matching the cleaning pain points of different scenarios and helping industrial upgrading.

Strong independent R&D team

Led by Professor Long Zhili of Harbin Institute of Technology, the company has a core technical team of over 30 people and owns the Shenzhen Advanced Manufacturing National Key Laboratory—ASM-Harbin Institute of Technology Semiconductor Packaging Laboratory. It deeply integrates industry, academia and research, and has obtained 4 invention patents in this field, as well as the quality management system certification GB/T19001-2016/ISO9001:2015.

Fast and timely after-sales response

Based in Shenzhen, Hakody leverages its strong manufacturing capabilities to shorten the entire cycle from order placement to delivery. It offers high cost-performance, fast service response, and can reach the user's site within 24 hours to quickly solve problems for customers, giving you peace of mind.

Wide Application Across Industries

Other Industries

Semiconductor Silicon Wafers

Nanoscale particle removal from wafer and chip surfaces provides megasonic-level cleanliness assurance for high-yield production.

Discover More

Semiconductor Silicon Wafers

Optical Devices

Medical Devices

Photovoltaic Industry

Precision Parts

About HKD

A leading provider of mega-sonic cleaning processes and equipment solutions, and a global innovator in semiconductor cleaning.

Getting Closer To HaKeDi

HaKeDi Megasonic Technology (Shenzhen) Co., LTD (hereinafter referred to as "HaKeDi" or "HKD") was founded in November 2024 and is headquartered in Shenzhen. It is a subsidiary jointly established by Harbin Institute of Technology (Shenzhen Campus) and Shenzhen Xincheng Environmental Protection Industry Co., Ltd. It is a high-tech enterprise focusing on the research and development and application of high-end precision cleaning technology for semiconductors and with "deep integration of industry, academia and research" as its core.

As China's first high-tech enterprise focusing on the independent research and development of megasonic modules for semiconductor wet cleaning equipment, the company is committed to breaking through "bottleneck" technologies and providing high-performance, high-reliability megasonic cleaning solutions for wafer cleaning, contributing to the rapid development of the localization process of core components for semiconductor equipment.